PHELICITI pursues the challenging task to co-integrate photonic and electronic subsystems on a single, 3D-integrated chip. As a collaborative project it gathers academia, research centers and two industrial partners in the field of semiconductor manufacturing and telecommunications.


Mar. 2018: PHELICITI has concluded with its 3D-integrated opto-electronics test-chip.

Short Facts - Project CV

Funding Framework:
     Austrian FFG programme
     “Intelligente Produktion”
     (contract no. 838835)

Project Lifetime:
     Nov. 2013 – Oct. 2017

Project Funding: 1.88 M€